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Shanmuga Sundaram Anandan


drss29@yahoo.co.in

Journal articles

2012
Shanmuga Sundaram Anandan, Anirudh Bhaskaran (2012)  PERFORMANCE EVALUATION OF THERMOSYPHON INTEGRATED HEAT SINK FOR CPU COOLING   Frontiers in Heat Pipes Vol. 3: No. 1. 1-7  
Abstract: An experimental study on Thermosyphon Integrated Heat Sink (TIHS) for CPU cooling has been carried out for both natural and forced convection to analyze the performance characteristics of the CPU cooling module (TIHS) at steady state condition. A thermal model based on the experimental values has been developed to study the thermal behavior of Thermosyphon Integrated Heat Sink during CPU cooling. The thermal model is employed to determine the actual heat transfer and the effectiveness of the CPU cooling module and compared it with the conventional cooling method and found that there is an appreciable improvement in the proposed CPU cooling module.
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2011
A Shanmuga Sundaram, Anirudh Bhaskaran (2011)  Thermal Modeling of Thermosyphon Integrated Heat Sink for CPU Cooling   Journal of Electronics Cooling and Thermal Control 1: 2. 15-21  
Abstract: A thermal model has been developed to study the thermal behavior of Thermosyphon integrated Heat Sink during CPU cooling. An Indirect cooling module has been experimentally studied and analyzed under steady state condition for both natural and forced convection. The thermal model is employed to determine the ac-tual heat transfer and the effectiveness of the present model and compared it with the conventional cooling method and found that there is an appreciable improvement in the present model.
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2010
A Shanmuga Sundaram, R V Seeniraj, R Velraj (2010)  An experimental investigation on passive cooling system comprising phase change material and two-phase closed thermosyphon for telecom shelters in tropical and desert regions   Energy and Buildings 42: 1726–1735  
Abstract: Advances in information technology have made the thermal management of telecommunication equipments more challenging over the past several years. As advances are being made the electrical energy consumption of telecommunication equipments is ever increasing and thereby increasing its dissipation rate. In addition such shelters are installed in remote areas, so cooling of telecom shelters becomes a great challenge for thermal engineers. A field study revealed conventional cooling systems are not so effective in terms of energy consumption and in the absence of power grid, shelters installed in such areas require additional capital cost to provide power for cooling system. A new passive cooling system incorporating phase change material (PCM) and two-phase closed thermosyphon (TPCT) heat exchangers has been developed and experimented to provide thermal management for telecommunication equipments housed in telecom shelters. The newly developed thermal system absorbs the equipment dissipated heat during the hottest part of the day, stores it as latent heat and releases it through thermosyphons during the night to the ambient.
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2009
A Shanmuga Sundaram, R Velraj, G Suganaya (2009)  Experimental investigation of transient characteristics of a heat pipe   Journal of Heat and Technology 27: 29-35  
Abstract: Heat pipe is an efficient heat exchange device which is being employed effectively in cooling and heat recovery systems at low operating cost. In the present work the thermal performance of a long heat pipe filled with methanol was investigated and transient heat transfer characteristics were studied experimentally by varying the condition of the surrounding fluid at the evaporator and condenser side. The effect of pulsed condenser ambient temperature on heat transfer rate was also determined.
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2007
Shanmuga Sundaram Anandan, Velraj Ramalingam (2007)  Thermal management of electronics: A review of literature   Thermal Science 12: 2. 5-26  
Abstract: Due to rapid growth in semi con duc tor tech nol ogy, there is a con tin u ous in crease of the sys tem power and the shrink age of size. This re sulted in in ev i ta ble chal lenges in the field of ther mal man age ment of elec tron ics to main tain the de sir able op er at ing tem per a ture. The pres ent pa per re views the lit er a ture deal ing with var i ous as pects of cool ing meth ods. In cluded are pa pers on ex per i men tal work on an a lyz ing cool - ing tech nique and its sta bil ity, nu mer i cal mod el ing, nat u ral con vec tion, and ad - vanced cool ing meth ods. The is sues of ther mal man age ment of elec tron ics, de vel - op ment of new ef fec tive cool ing schemes by us ing ad vanced ma te ri als and man u fac tur ing meth ods are also enu mer ated in this pa per.
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2012
R Shanthi, Shanmuga Sundaram Anandan, Velraj Ramalingam (2012)  Heat transfer enhancement using nanofluids: An overview   Thermal Science 16: 2. 423-444  
Abstract: Nanofluids are colloidal mixtures of nanometric metallic or ceramic particles in a base fluid, such as water, ethylene glycol or oil. Nanofluids possess immense potential to enhance the heat transfer character of the original fluid due to improved thermal transport properties. In this article, a brief overview has been presented to address the unique features of nanofluids, such as their preparation, heat transfer mechanisms, conduction and convection heat transfer enhancement, etc. In addition, the article summarizes the experimental and theoretical work on pool boiling in nanofluids and their applications.
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